Bond Force is a seventh-generation single component light-cured dental adhesive that requires one single application to achieve award-winning bond strength. Self-leveling technology allows for a uniform adhesive layer.
Outstanding bond strength with your preferred dispensing system
Bond Force is a seventh-generation single component light-cured dental adhesive that requires one single application to achieve award-winning bond strength. The self-leveling technology allows for a uniform adhesive layer that has a film thickness as thin as 8μm.
OUTSTANDING BOND STRENGTH
Bond Force creates a 3-D fusion link to the tooth generating an extremely strong bond to enamel and dentin. While releasing fluoride and preventing post-op sensitivity, Bond Force requires only one application, and is designed to be used on both cut/uncut enamel and dentin.
YOU CHOOSE YOUR ETCHING METHOD
No mixing, etching or rinsing is required. Nevertheless, Bond Force gives you the flexibility to choose self-etch or selective enamel-etch depending on the case and doctor’s preference. Additionally, Bond Force allows for 5 minutes extended working time with only 10 seconds of light-curing.
MOIST, WET or DRY
Bond Force is not technique sensitive, it works great under any surface moisture conditions. In fact, a dry tooth provides the highest bond strength.
FEATURES & BENEFITS
Excellent bond strength to enamel and dentin
One Step: No etching, No rinsing, No mixing
Thin film thickness (8µm)
Designed for cut/uncut enamel and dentin
Self-leveling technology (Uniform adhesive layer)
Extended working time (5 minutes)
Bonding of Light/Dual Cure Composite material to:
Cut/uncut enamel and dentin
Fractured porcelain/composite repair
EASY APPLICATION PROCESS:
“Apply, Dry, Light Cure.”
SELF-ETCHING PROCEDURE STEPS
Standard warranty covered by seller against any manufacturing defect. In such events, please report to us within 7 days from date of delivery at firstname.lastname@example.org.
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